ligitek electronics co.,ltd. property of ligitek only lsd1015/6sbks-xx doc. no : qw0905- rev. : a date : - 2005 15 - oct. lsd1015/6sbks-xx data sheet single digit led display (1.0 inch)
27.75 (1.093") b j i f h 33.0 (1.299") 25.4 (1.0") g2 d1 18.1(0.713") note : 1.all dimension are in millimeters and (lnch) tolerance is 0.25(0.01") unless otherwise noted. 2.specifications are subject to change without notice. 8.5 (0.335") pin no.1 d2 e g1 l mk 1.8(0.071") 6.05 0.5 c 22.8(0.898") lsd1015/6sbks-xx ligitek package dimensions part no. a1 lsd1015/6sbks-xx a2 8.9(0.35") page1/7 ligitek electronics co.,ltd. property of ligitek only
m 11 m 11 d2 10 a1 2 d1 14 a2 22 b 21 c 16 g2 19 f 4 g1 7 e 9 h 3 j 23 k 15 l 12 d2 10 a2 22 a1 2 d1 14 b 21 c 16 lsd1016sbks-xx 6,18 g2 19 f 4 g1 7 e 9 k 15 h 3 j 23 l 12 ldp 1 rdp 13 i 24 ldp 1 rdp 13 i 24 ligitek electronics co.,ltd. property of ligitek only internal circuit diagram lsd1015/6sbks-xx part no. 6,18 lsd1015sbks-xx page2/7
part no.lsd1015/6sbks-xx electrical connection 8 no pin 8 no pin 20 no pin anode i anode j anode a2 anode b 23 24 22 21 common cathode 14 anode d1 anode c anode k no pin anode g2 17 19 18 16 15 anode rdp anode l anode m anode d2 anode e 11 12 13 9 10 no pin 20 cathode b cathode a2 cathode j cathode i 23 24 22 21 cathode d1 cathode rdp cathode c cathode m cathode d2 cathode e cathode l cathode k cathode g2 commom anode 14 17 19 18 15 16 no pin 11 12 13 9 10 ligitek electronics co.,ltd. property of ligitek only lsd1015sbks-xx common cathode 2 anode a1 anode g1 no pin anode f anode h 5 6 7 3 4 anode ldp pin no. 1 cathode f cathode h cathode ldp cathode a1 commom anode cathode g1 2 5 7 6 4 3 no pin pin no. 1 lsd1016sbks-xx page3/7
a ligitek electronics co.,ltd. property of ligitek only unit ma ma mw page lsd1015sbks-xx lsd1016sbks-xx part no part selection and application information(ratings at 25) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. d ( nm) common cathode or anode emitted ingan/sic blue material common cathode common anode 475 chip (nm) vf(v)iv(mcd) 3.5 typ. 26 10.5 4.218.0 min. max. typ. electrical reverse current per any chip operating temperature storage temperature solder temperature 1/16 inch below seating plane for 3 seconds at 260 peak forward current per chip (duty 1/10,0.1ms pulse width) power dissipation per chip forward current per chip absolute maximum ratings at ta=25 parameter lsd1015/6sbks-xx part no. i f 30 tstg t opr pd ir i fp -25 ~ +85 -25 ~ +85 50 120 100 symbol ratings sbks iv-m 2:1 4/7 electrostatic discharge( * ) esd 2000 v static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. *
test condition for each parameter forward voltage per chip luminous intensity matching ratio luminous intensity per chip dominant wavelength spectral line half-width reverse current any chip part no. parameter lsd1015/6sbks-xx vf volt if=20ma vr=5v if=10ma if=20ma if=20ma iv-m mcd nm a nm ir d iv test condition ligitek electronics co.,ltd. property of ligitek only unit symbol page5/7
6/7 page ligitek electronics co.,ltd. property of ligitek only part no. lsd1015/6sbks-xx 1.25 1.5 fig.2 relative intensity vs. forward current 20 101525 30 0.5 0.75 0.25 0 forward voltage(v) 5 0 345 forward current(ma) r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 1.0 sbk-s chip 20 25 30 15 10 5 0 1 f o r w a r d c u r r e n t ( m a ) typical electro-optical characteristics curve fig.1 forward current vs. forward voltage 2 1.0 0.5 fig.4 relative intensity vs. wavelength wavelength (nm) 75 50100 r e l a t i v e i n t e n s i t y @ 2 0 m a 580 380 0 480 480 430 530 630 680 30 40 20 10 0 f o r w a r d c u r r e n t @ 2 0 m a 0 fig.3 forward current vs. temperature ambient temperature( ) 25
solderability test solder resistance test high temperature high humidity test thermal shock test reliability test: part no. low temperature storage test high temperature storage test operating life test test item this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=260 5 2.dwell time= 10 1sec. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.t.sol=230 5 2.dwell time=5 1sec this test intended to see soldering well performed or not. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 ligitek electronics co.,ltd. property of ligitek only jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 reference standard this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. 1.under room temperature 2.if=10ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this test is the resistance of the device under tropical for hous. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. test condition lsd1015/6sbks-xx description 7/7 page
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